发明名称 CONVERTER MODULE AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a converter module which has a converter and a rectangle semiconductor substrate on a rectangle substrate, and can achieve miniaturization and cost reduction. <P>SOLUTION: The converter module comprises a substrate 2 having a rectangular shape; a converter 3 having a polygonal shape containing at least one of acute-angle apex; and a semiconductor substrate 4 having a rectangular shape. The converter 3 is arranged on the substrate 2 so that a first side of the substrate 2 is substantively parallel to one side of the converter 3, and the semiconductor substrate 4 is arranged on the substrate 2 so that the first side of the substrate 2 is substantively parallel to one side of the semiconductor substrate 4. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012004326(A) 申请公布日期 2012.01.05
申请号 JP20100137770 申请日期 2010.06.16
申请人 PANASONIC CORP 发明人 INOUE DAISUKE;FUJII KYOKO
分类号 H01L29/84;B81B3/00;B81C3/00;H01L25/16;H04R19/04;H04R31/00 主分类号 H01L29/84
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