| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a housing for an electronic device obtained by performing the baking finish to the surface of a composite molded body in which a metal member made of a magnesium alloy and a resin for molding are integrally molded by injection molding, in which warpage is reduced, and also, floating and peeling are hard to be generated at the coated part in a joint between the metal member and the resin for molding. <P>SOLUTION: The housing for an electronic device is obtained by performing the baking finish to the surface of a composite molded body composed of: a metal member made of a magnesium alloy; and a resin for molding made of a noncrystalline thermoplastic resin. The metal member and the resin for molding are joined via an adhesive layer. The adhesive layer is composed of an adhesive composition, which contains, as essential components: (A) an epoxy resin; (B) a curing agent for the epoxy resin; and (C) an elastomer, and in which the (C) elastomer is contained by 5 to 40 pts.mass to 100 pts.mass of the (A) epoxy resin. Further, the baking finish is performed using a two liquid mixed-type baking finish material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
