发明名称 CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR
摘要 It is an object of the present invention to provide a clathrate that suppresses a curing reaction at low temperature to promote an improvement in storage stability (one-component stability), and can effectively cure a resin by heating treatment. A clathrate suitable for the clathrate is a clathrate containing (b1) at least one selected from the group consisting of an aliphatic polyvalent carboxylic acid, 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, 5-hydroxyisophthalic acid, isophthalic acid, and benzophenone-4,4′-dicarboxylic acid; and (b2) at least one selected from the group consisting of an imidazole compound represented by the following formula (I), and 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1.
申请公布号 US2012004377(A1) 申请公布日期 2012.01.05
申请号 US201013138654 申请日期 2010.03.15
申请人 KANEKO MASAMI;ONO KAZUO;NIPPON SODA CO., LTD. 发明人 KANEKO MASAMI;ONO KAZUO
分类号 C08G59/42;C07D233/58;C07D233/64;C07D487/04 主分类号 C08G59/42
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