发明名称 Method of making a semiconductor device, and semiconductor device made thereby
摘要 A semiconductor device comprises a semiconductor substrate (110) having a patterned interconnect layer (120) formed thereon. A first capacitor (210), a second capacitor (220), and a resistor (230) are formed over the interconnect layer. The first capacitor comprises a layer of electrode material and a first number of dielectric layers. The second capacitor comprises the layer of electrode material and a second number of dielectric layers. The first number of dielectric layers is greater than he second number of dielectric layers such that the first capacitor has a higher capacitance per unit area than does the second capacitor.
申请公布号 KR101102785(B1) 申请公布日期 2012.01.05
申请号 KR20067018444 申请日期 2005.02.10
申请人 发明人
分类号 H01L27/108;H01L21/02;H01L21/20;H01L21/8242;H01L27/06;H01L29/00;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L27/108
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