| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame for use in a pad-type or heat dissipation-type semiconductor device capable of achieving a high heat dissipation effect by preventing a sealing resin from flowing into between the back of an element mounting portion and a mold die to produce a thin burr during the filling of the sealing resin, and to provide a lead frame manufacturing method, a semiconductor device, and a semiconductor device manufacturing method. <P>SOLUTION: In the pad-type or heat dissipation-type semiconductor device 10 and a lead frame 18 used for the semiconductor device 10 in which an element mounting portion 12 for mounting a semiconductor chip 11 thereon is exposed from the underside of the sealing resin 13, a projecting wall 14 preventing generation of thin burr during the filling of the sealing resin is provided around the exposed surface of the exposed element mounting portion 12. <P>COPYRIGHT: (C)2012,JPO&INPIT |
