| 摘要 |
PURPOSE: A method for mounting a light emitting diode package is provided to uniformize the thickness of a junction layer by bonding the light emitting diode package to a printed circuit board using an igniting metal layer with uniform thickness. CONSTITUTION: An igniting metal layer(20) with a solder coating layer is prepared. The igniting metal layer is arranged between a surface mount light emitting diode package(10) and a printed circuit board(30). The light emitting diode package includes a package body(11), a lead terminal(13a,13b), a heat sink(15), and a light emitting diode(17). The printed circuit board includes a bonding pad(33a,33b) and a landing pad(33c). The package body or heat sink is bonded to the landing pad. |
