发明名称 |
CURABLE ORGANOPOLYSILOXANE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE |
摘要 |
<p>A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.</p> |
申请公布号 |
WO2012002561(A1) |
申请公布日期 |
2012.01.05 |
申请号 |
WO2011JP65248 |
申请日期 |
2011.06.28 |
申请人 |
DOW CORNING TORAY CO., LTD.;YOSHITAKE, MAKOTO;YAMAKAWA, MIEKO |
发明人 |
YOSHITAKE, MAKOTO;YAMAKAWA, MIEKO |
分类号 |
C08L83/04;C08L83/05;C08L83/07;H01L23/29 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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