| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a micro-electromechanical systems (MEMS) switching array suitable for improving packing density and/or flexible interconnectivity for the array components. <P>SOLUTION: An MEMS switching array is provided. A first substrate (22) (e.g., carrier substrate) includes an electrically conductive substrate region. An electrical isolation layer (24) may be disposed over a first surface of the carrier substrate (22). Movable actuators (26) may be provided. At least one substrate contact (28) is electrically coupled to at least one of the plurality of movable actuators (26) so that a flow of electrical current is established during an electrically-closed condition of the MEMS switching array. A cover substrate (50) may also be provided and includes an electrically conductive substrate region. The electrically conductive region of the carrier substrate (50) is electrically coupled to the electrically conductive region of the cover substrate (22) to define an electrically conductive path for the flow of electrical current during the electrically-closed condition of the switching array. <P>COPYRIGHT: (C)2012,JPO&INPIT |
