发明名称 MANUFACTURING METHOD OF CERAMIC ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic electronic component capable of manufacturing the ceramic electronic component having a small height dimension with high shape accuracy. <P>SOLUTION: A plurality of holes 22a are formed by the irradiation of laser light on a cutting line of an unsintered ceramic mother block 22. Conductive paste is coated on the unsintered ceramic mother block 22 having the plurality of holes 22a formed thereon. By cutting the unsintered ceramic mother block 22 having the coated conductive paste into a plurality of portions on the cutting line, a plurality of unsintered ceramic elements 24 are manufactured. By sintering the plurality of unsintered ceramic elements 24, a plurality of ceramic electronic components 1 are manufactured. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012004180(A) 申请公布日期 2012.01.05
申请号 JP20100135284 申请日期 2010.06.14
申请人 MURATA MFG CO LTD 发明人 SATO KOJI;SANADA YUKIO
分类号 H01G4/30;H01G4/12;H01G13/00 主分类号 H01G4/30
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