发明名称 LASER CUT MACHINING DEVICE FOR EXTRA THIN METAL PLATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser cut machining device for an extra thin metal plate wherein the variation in the position of a condensing point by an assist gas is restrained with a simple constitution. SOLUTION: On the lower part of a machining head 3, a holder 7, which encloses the outer periphery of a nozzle 6, and whose distance to the lower end coincides with a focal distance of a laser beam, is provided, and a support plate 12 energized upward by an elastic member 14 is provided direct below the machining head 3. In this way, the work W is energized upward by the elastic member to come into close contact with the holder 7, thereby the distance from a condenser lens 4 to the surface of the work can be always made constant.</p>
申请公布号 JP2003103388(A) 申请公布日期 2003.04.08
申请号 JP20010293934 申请日期 2001.09.26
申请人 NIPPON SHARYO SEIZO KAISHA LTD 发明人 NISHIWAKI YASUKI
分类号 B23K26/02;B23K26/00;B23K26/14;B23K26/38;B23K101/18;(IPC1-7):B23K26/02 主分类号 B23K26/02
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