| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce errors in positioning recognition of good chips when semiconductor chips are picked up. <P>SOLUTION: A manufacturing method comprises: a step of placing a wafer 10 cut into multiple semiconductor chips 170 on an XY table; a step of registering each coordinate of the multiple semiconductor chips in a grid form; a step of placing a pickup portion to be opposed to a start chip 100, which is a good chip nearest to the center of the grid array by controlling the position of the XY table in accordance with the coordinates of the multiple semiconductor chips 170; and a step of picking up and moving good chips, in turn from the start chip 100, with the pickup portion. In the step of picking up good chips, the good chips are picked up from inside to outside in a spiral direction in turn from the start chip 100. <P>COPYRIGHT: (C)2012,JPO&INPIT |
