发明名称 HEAT PUMP SYSTEM
摘要 <p>A heat pump system (1) include: a heat-source-side refrigerant circuit (20) having a heat-source-side compressor (21), a first usage-side heat exchanger (41a) capable of functioning as a radiator of the heat-source-side refrigerant, and a heat-source-side heat exchanger (24) capable of functioning as a radiator of the heat-source-side refrigerant; and a usage-side refrigerant circuit (40a) having a usage-side compressor (62a), a refrigerant/water heat exchanger, (65a) capable of functioning as a radiator of the usage-side refrigerant to heat an aqueous medium, and the first usage-side heat exchanger (41a) capable of functioning as an evaporator of the usage-side refrigerant by radiation of the heat-source-side refrigerant, wherein the capacity of the heat-source-side compressor (21) is controlled so that a saturation temperature corresponding to the pressure of the heat-source-side refrigerant in the discharge of the heat-source-side compressor (21) becomes a target temperature; and the capacity of the usage-side compressor (62a) is controlled so that a saturation temperature corresponding to the pressure of the usage-side refrigerant in the discharge of the usage-side compressor (62a) becomes a target temperature.</p>
申请公布号 EP2402684(A1) 申请公布日期 2012.01.04
申请号 EP20100745960 申请日期 2010.02.23
申请人 DAIKIN INDUSTRIES, LTD.;DAIKIN EUROPE N.V. 发明人 HONDA, MASAHIRO
分类号 F25B7/00;F24D11/02;F25B1/00;F25B13/00;F25B49/02 主分类号 F25B7/00
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