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发明名称
DIE STACKING SYSTEM AND METHOD
摘要
Die stacking systems and methods are disclosed. In an embodiment, a die has a surface that includes a passivation area, at least one conductive bond pad area, and a conductive stacked die receiving area sized to receive at least a second die.
申请公布号
KR101101499(B1)
申请公布日期
2012.01.03
申请号
KR20097026232
申请日期
2008.05.16
申请人
发明人
分类号
H01L23/12;H01L23/48
主分类号
H01L23/12
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代理人
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