| 摘要 |
<p>PURPOSE: A lead pin for semiconductor package and a semiconductor package are provided to improve junction efficiency by increasing the contact area between a head unit and a solder paste. CONSTITUTION: In a lead pin for semiconductor package and a semiconductor package, a semiconductor chip(30) is electrically connected in the surface of a substrate(20), In the bottom surface of the substrate, a pad part(22) which is electrically connected to the lead pin(100). The lead pin comprises a connection pin, a head unit, and a fence unit. The connection pin and head unit are formed into one body. A photoresist layer(50) is arranged around the pad.</p> |
