| 摘要 |
A package for storing a semiconductor element mounted on an upper surface of a substrate (52) is configured by a substrate (52) and a conductive cap (54). A grounding electrode (57) is annularly formed on an upper surface outer circumferential section of the substrate (52). An upper surface of an inner circumferential section of the grounding electrode (57) is covered with a solder resist (67). On an outer circumference lower end surface of the conductive cap (54), a flange (70) substantially horizontally bent is formed. The conductive cap (54) is arranged on the upper surface of the substrate (52), and a lower surface of the flange (70) is permitted to abut to an upper surface of the solder resist (67). Furthermore, on a further outer circumferential side from the solder resist (67), a space formed between the lower surface of the flange (70) and the grounding electrode (57) is filled with a conductive bonding member (73), and the conductive cap (54) is bonded to the substrate (52). |
