| 摘要 |
PURPOSE: A solder ball and a semiconductor package are provided to implement the electrical contact of a substrate and a semiconductor chip and the reflow process for forming the underfill layer simultaneously by forming the underfill part surrounding the outside of the core part. CONSTITUTION: A solder ball(130) comprises a core unit(132) and an underfill part(134). The core unit electrically conducts a semiconductor chip(110) and a substrate part(120). The underfill part is coated on the core unit in order to protect the outside of the core unit. The underfill part protects the periphery of the core unit when contacting the core part and the semiconductor chip. |
