发明名称 |
METAL INK COMPOSITION AND METHOD FOR FORMING THE METAL LINE USING THE SAME, AND CONDUCTIVE PATTERN FORMED BY USING THE METAL INK COMPOSITION |
摘要 |
<p>PURPOSE: A metallic ink composition, a metal wire producing method using thereof, and a conductive pattern obtained by thereof are provided to prevent the generation of cracks when producing a metal wire with the metallic ink composition. CONSTITUTION: A metallic ink composition for producing conductive patterns contains 20-80 parts of metal nanoparticles by weight, 10-70 parts of non-aqueous organic solvent by weight, and 2-20 parts of drying agent by weight for controlling the drying speed of the coated metallic ink composition. The drying agent contains a metal compound obtained by combining fatty acid with a divalent metallic ion.</p> |
申请公布号 |
KR20110139942(A) |
申请公布日期 |
2011.12.30 |
申请号 |
KR20100060074 |
申请日期 |
2010.06.24 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, TAE HOON;SEO, YOUNG KWAN;KIM, DONG HOON;JUN, BYUNG HO;KIM, SUNG EUN |
分类号 |
H05K3/10;B22F9/00;B41M5/00;C09D11/00;C09D11/36;C09D11/38;C09D11/52;H01B1/00;H01B1/22;H01B5/14;H01B13/00 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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