发明名称 METHOD OF CUTTING SINGLE CRYSTALS
摘要 An embodiment of the invention provides a single crystal cleaved from a larger crystal and having a cleavage surface that extends along a natural crystallographic plane of the single crystal, the cleavage surface produced by generating a stress field to propagate a crack in the larger crystal along the natural plane, so that during cracking by the stress field a magnitude of a derivative of an energy release rate, G(α), generated by the stress field at a front of the crack as a function of angular deviation,α, from the natural plane, is less than or equal to twice an effective step energy,βe, divided by a step height, h.
申请公布号 US2011318221(A1) 申请公布日期 2011.12.29
申请号 US201113226519 申请日期 2011.09.07
申请人 HAMMER RALF;JURISCH MANFRED;FREIBERGER COMPOUND MATERIALS GMBH 发明人 HAMMER RALF;JURISCH MANFRED
分类号 C22C28/00 主分类号 C22C28/00
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