| 摘要 |
A plating device for plating a substrate includes a plating solution container for retaining a plating solution. The plating solution container has a sidewall and an opening portion surrounded with the sidewall. Further, the plating device includes a holding member for holding the substrate so that the substrate faces the opening portion of the solution container and is situated away from the plating solution container; a cathode electrode for contacting with an outer circumferential portion of the substrate; an anode electrode for contacting the plating solution in the plating solution container; a plating solution supply device for supplying the plating solution into the plating solution container so that the plating solution overflows through a space between the plating solution container and the substrate after the plating solution contacts with the substrate; and a through hole formed in the sidewall of the plating solution container. |
