发明名称 |
CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM |
摘要 |
A diluent-free curable epoxy resin composition for preparing a composite comprising: (A) at least one epoxy resin composition comprising a blend of: (A1) at least one epoxy resin, and (A2) at least one divinylarene dioxide; and (B) at least one hardener composition; and (C) at least one reinforcement materials; wherein the viscosity of the curable composition is the range of from about 0.15 Pa-s to about 1.5 Pa-s; and wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the composition being cured provides a cured composite product having an increased Tg of greater than about 5 °C as compared to a curable composition having a reactive diluent.
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申请公布号 |
CA2803851(A1) |
申请公布日期 |
2011.12.29 |
申请号 |
CA20112803851 |
申请日期 |
2011.06.22 |
申请人 |
DOW GLOBAL TECHNOLOGIES LLC |
发明人 |
THEOFANOUS, THEOFANIS;VERGHESE, KANDATHIL, E.;JACOB, GEORGE |
分类号 |
C08G59/22;C08G59/24;C08J5/24;C08L59/02;C08L63/00 |
主分类号 |
C08G59/22 |
代理机构 |
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地址 |
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