| 摘要 |
An LED chip package structure includes a substrate; a first circuit pattern disposed on a surface of the substrate, wherein the first circuit pattern is divided into an electrical connection portion and a carrier portion; a second circuit pattern disposed on another surface of the substrate; a plurality of vias disposed in the substrate and connecting the first circuit pattern and the second circuit pattern, wherein the vias are filled with conductive material; and a plurality of LED chips disposed on the carrier portion of the substrate and electrically connected with the electrical connection portion. The vias filled with the conductive material are utilized to enhance heat dissipation of the substrate.
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