发明名称 Copper paste and wiring board using the same
摘要 A wiring board comprising: a conductor layer comprising Fe and Cu; and at least one of a radiator, a connection terminal, a cover and a circuit component, connected to the conductor layer through a joining member, which is obtained by coating a copper paste comprising a copper powder, an organic vehicle and an Fe 2 O 3 particle as a conductor layer on a ceramic green sheet and firing it.
申请公布号 EP1385204(B1) 申请公布日期 2011.12.28
申请号 EP20030016263 申请日期 2003.07.17
申请人 NGK SPARK PLUG CO., LTD 发明人 SUMI, HIROSHI;MIZUTANI, HIDETOSHI;SATO, MANABU
分类号 H01L23/498;H01B1/22;H01L23/047;H05K1/02;H05K1/09;H05K1/18 主分类号 H01L23/498
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