发明名称 |
Copper paste and wiring board using the same |
摘要 |
A wiring board comprising: a conductor layer comprising Fe and Cu; and at least one of a radiator, a connection terminal, a cover and a circuit component, connected to the conductor layer through a joining member, which is obtained by coating a copper paste comprising a copper powder, an organic vehicle and an Fe 2 O 3 particle as a conductor layer on a ceramic green sheet and firing it. |
申请公布号 |
EP1385204(B1) |
申请公布日期 |
2011.12.28 |
申请号 |
EP20030016263 |
申请日期 |
2003.07.17 |
申请人 |
NGK SPARK PLUG CO., LTD |
发明人 |
SUMI, HIROSHI;MIZUTANI, HIDETOSHI;SATO, MANABU |
分类号 |
H01L23/498;H01B1/22;H01L23/047;H05K1/02;H05K1/09;H05K1/18 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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