发明名称 Circuit board having conductive shield member and semiconductor package using the same
摘要 A circuit board having a board body includes a via structure. The via structure includes a conductive connector passing through the board body and a conductive shield member surrounding at least a portion of the conductive connector. The shield member prevents distortion of a data signal applied to the conductive connector, and also intercepts electromagnetic waves generated by the conductive connector.
申请公布号 US8084839(B2) 申请公布日期 2011.12.27
申请号 US20100871072 申请日期 2010.08.30
申请人 CHOI BOK KYU;LIM SANG JOON;JANG EUL CHUL;HYNIX SEMICONDUCTOR INC. 发明人 CHOI BOK KYU;LIM SANG JOON;JANG EUL CHUL
分类号 H01L29/00;H01L23/00;H01L23/48;H01L23/52;H01L23/538;H01L29/40 主分类号 H01L29/00
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