发明名称 |
Circuit board having conductive shield member and semiconductor package using the same |
摘要 |
A circuit board having a board body includes a via structure. The via structure includes a conductive connector passing through the board body and a conductive shield member surrounding at least a portion of the conductive connector. The shield member prevents distortion of a data signal applied to the conductive connector, and also intercepts electromagnetic waves generated by the conductive connector. |
申请公布号 |
US8084839(B2) |
申请公布日期 |
2011.12.27 |
申请号 |
US20100871072 |
申请日期 |
2010.08.30 |
申请人 |
CHOI BOK KYU;LIM SANG JOON;JANG EUL CHUL;HYNIX SEMICONDUCTOR INC. |
发明人 |
CHOI BOK KYU;LIM SANG JOON;JANG EUL CHUL |
分类号 |
H01L29/00;H01L23/00;H01L23/48;H01L23/52;H01L23/538;H01L29/40 |
主分类号 |
H01L29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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