Semiconductor memory device, and multi-chip package and method of operating the same

摘要

Multi-chip package devices and related data programming methods are disclosed. A multi-chip package device includes one or more memory chips and a controller. The one or more memory chips include a single level cell section and a multi level cell section. The controller is configured to control a first data storing operation for storing an input data to the single level cell section and control a second data storing operation for storing the input data stored in the single level section to the multi level cell section during an idle time.