发明名称 |
Tin electrolytic plating solution for electronic parts, method for tin electrolytic plating of electronic parts, and tin electroplated electronic parts |
摘要 |
A tin electrolytic plating solution comprises a suitably selected nonionic surfactant having a branched alkyl group. The nonionic surfactant is contained either alone, or with a suitably selected cationic surfactant and/or a suitably selected alkyl imidazole. The invention also provides a tin electrolytic plating method using such a tin electrolytic plating solution, and a tin electroplated electronic part obtained by such a method. |
申请公布号 |
US8083922(B2) |
申请公布日期 |
2011.12.27 |
申请号 |
US20080184138 |
申请日期 |
2008.07.31 |
申请人 |
ORIKASA MAKOTO;MAKINO TOSHIAKI;TAIYO YUDEN CO., LTD. |
发明人 |
ORIKASA MAKOTO;MAKINO TOSHIAKI |
分类号 |
C25D3/30;C23C16/40;C25D3/32 |
主分类号 |
C25D3/30 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|