Integrated circuit package system with offset stacking

摘要

An integrated circuit package system includes: providing an interposer having a bond pad and a contact pad; mounting the interposer in an offset location over a carrier with an exposed side of the interposer coplanar with an edge of the carrier; connecting an electrical interconnect between bond pad and the carrier; and forming a package encapsulation over the carrier and the electrical interconnect with both the contact pad and the exposed side of the interposer not covered.