LED MODULE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A method for manufacturing a light emitting diode module is provided to form an insulating layer on the surface of a heat emitting substrate, thereby facilitating mounting of a light emitting diode chip. CONSTITUTION: An insulating layer(13) is formed on the top of a heat emitting substrate(11). An electrode pattern layer is formed on the top of the insulating layer. A plurality of light emitting diode chips(17) is connected to the electrode pattern layer. A fluorescent layer is applied onto the light emitting diode chips. A reflector is attached around the light emitting diode chips.