| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for optical semiconductor device which exhibits excellent heat resistance and can impart good light reflectivity. <P>SOLUTION: An epoxy resin composition for an optical semiconductor device comprises: a metal lead frame 1; and a reflector 3 formed on the periphery of an optical semiconductor element 2 mounted thereon, in which a material forming the reflector 3 contains following components (A)-(C) but does not contain an inorganic filler, and the content of a component (C), i.e. titanium oxide, is set in the range of 3-90 wt% of whole epoxy resin composition. (A) epoxy resin, (B) hardener, (C) titanium oxide. <P>COPYRIGHT: (C)2012,JPO&INPIT |
