Printed Circuit Board And Semiconductor Package Including The Same

摘要

A semiconductor package may include a base substrate, a solder resist layer on the base substrate, a first semiconductor chip mounted on the base substrate, and a second semiconductor chip stacked on the first semiconductor chip. The second semiconductor chip may include at least one end portion protruding from the first semiconductor chip. The solder resist layer may include and a recess portion. The recess portion may be formed in the solder resist layer at a position corresponding to the at least one end portion of the second semiconductor chip.