| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of peeling a protective tape in which a protective tape stuck to the rear surface of a wafer is peeled precisely, and cracking can be prevented in a semiconductor wafer and a semiconductor element layer. <P>SOLUTION: The method of peeling a protective tape stuck to the element formation surface of a semiconductor wafer includes a step for sticking an adhesive tape to a surface on the reverse side of the element formation surface so that an inner region is formed on the inside of the outer edge of the semiconductor wafer and an outer region extending to the outside of the semiconductor wafer is formed over the entire outer edge of the semiconductor wafer, a step for sucking the semiconductor wafer to a suction stage mechanism by sucking the adhesive tape, and a step for peeling the protective tape from the semiconductor wafer. The suction stage mechanism sucks the inner region and the outer region in the step for sucking the adhesive tape. <P>COPYRIGHT: (C)2012,JPO&INPIT |
