LAMINATED ELECTRONIC COMPONENT MANUFACTURING DEVICE AND METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENTS

摘要

PROBLEM TO BE SOLVED: To provide a laminated electronic component manufacturing device and a method for manufacturing laminated electronic components capable of eliminating a step part between electrode circuits and manufacturing high-quality laminated electronic components.

SOLUTION: The laminated electronic component manufacturing device comprises: a continuous endless deposition substrate 12 where mold release treatment was applied to an outer periphery; a deposition formation part 16 which forms a ceramic sheet by applying a ceramic slurry to the deposition substrate 12 and drying the ceramic slurry; an electrode circuit formation part 22 which forms an electrode circuit 24 on a ceramic sheet S; a dielectric coating film formation part 38 which forms a dielectric coating film 36 on a step part 34 on the ceramic sheet S resulting from formation of the electrode circuit 24; and a lamination support body 14 which forms a laminate structure S' of the ceramic sheet S.

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