发明名称 Pressure sensor module has pressure measurement chip that is housed in housing, where pressure measurement chip is impinged with pressure over opening
摘要 <p>#CMT# #/CMT# The pressure sensor module (10) has a pressure measurement chip (18) that is housed in a housing, where the pressure measurement chip is impinged with a pressure over an opening (38). A flex foil (32) is electrically connected with the pressure measurement chip over electrical contacts (22) and is fixed at fixing positions (48,50) in the housing. #CMT# : #/CMT# An independent claim is also included for a method for manufacturing a pressure sensor module. #CMT#USE : #/CMT# Pressure sensor module. #CMT#ADVANTAGE : #/CMT# The pressure sensor module has a pressure measurement chip that is housed in a housing, where the pressure measurement chip is impinged with a pressure over an opening, and thus ensures improved pressure sensor module. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a sectional view of a pressure sensor module. 10 : Pressure sensor module 18 : Pressure measurement chip 22 : Electrical contacts 32 : Flex foil 38 : Opening 48,50 : Fixing positions.</p>
申请公布号 DE102010030319(A1) 申请公布日期 2011.12.22
申请号 DE20101030319 申请日期 2010.06.21
申请人 ROBERT BOSCH GMBH 发明人 HERDERICH, HANS-JUERGEN;DOERING, CHRISTOPH HANS-MARTIN
分类号 G01L19/00;G01L9/00 主分类号 G01L19/00
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