发明名称 |
CHIP PACKAGE WITH DIE AND SUBSTRATE |
摘要 |
A thin film semiconductor die circuit package is provided utilizing low dielectric constant (k) polymer material for the insulating layers of the metal interconnect structure. Five embodiments include utilizing glass, glass-metal composite, and glass/glass sandwiched substrates. The substrates form the base for mounting semiconductor dies and fabricating the thin film interconnect structure. |
申请公布号 |
US2011309473(A1) |
申请公布日期 |
2011.12.22 |
申请号 |
US201113159190 |
申请日期 |
2011.06.13 |
申请人 |
LIN MOU-SHIUNG;LEE JIN-YUAN;HUANG CHING-CHENG;MEGICA CORPORATION |
发明人 |
LIN MOU-SHIUNG;LEE JIN-YUAN;HUANG CHING-CHENG |
分类号 |
H01L23/498;H01L21/60;H01L21/68;H01L23/31;H01L23/538 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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