发明名称 |
LAMINATED WORKPIECE SEGMENTATION SYSTEM AND LAMINATED WORKPIECE SEGMENTATION METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated workpiece segmentation system and a laminated workpiece segmentation method capable of continuously cutting out thin workpieces one by one with a predetermined pressing force from a laminated workpiece with a sticking force being reduced by separation enhancement to smoothly convey the thin workpieces. <P>SOLUTION: A laminated workpiece segmentation system comprises: a separation tank 20 which enhances the separation of a laminated workpiece; a segmentation device 30 in which a segmentation conveyor cuts out an uppermost workpiece of the laminated workpiece while enhancing the separation of the laminated workpiece; a multiple workpiece feeding prevention device 40 which prevents the passage of two or more workpieces; a workpiece vibration conveying device 50 which chips a cracked corner portion by conveying the workpiece while vibrating it; a chipped workpiece identification device 60 which detects the chipped corner portion of the workpiece being conveyed; a workpiece sorting device 70 which passes a non-defective workpiece to the downstream side and collects the chipped workpiece; and a workpiece housing device 80 which houses the non-defective workpiece. This invention also provides a laminated workpiece segmentation method using this system. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011258648(A) |
申请公布日期 |
2011.12.22 |
申请号 |
JP20100130136 |
申请日期 |
2010.06.07 |
申请人 |
HAMAI CO LTD;SAITOU SEIKI CO LTD |
发明人 |
KASE MITSUO;SUGISHITA HIROSHI;AMI MASAAKI;NIKI MASAYUKI |
分类号 |
H01L21/677;B65G59/02 |
主分类号 |
H01L21/677 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|