| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a coil encapsulation green compact core and manufacturing method thereof capable of specifically improving soldering workability compared with the conventional art. <P>SOLUTION: The device includes: a green compact core in which powder of Fe-based metal glass alloy, where its composition formula is Fe<SB POS="POST">100-a-b-c-x-y-z-t</SB>Ni<SB POS="POST">a</SB>Sn<SB POS="POST">b</SB>Cr<SB POS="POST">c</SB>P<SB POS="POST">x</SB>C<SB POS="POST">y</SB>B<SB POS="POST">z</SB>Si<SB POS="POST">t</SB>, 0 atom%≥a≥10 atom%, 0 atom%≥b≥3 atom%, 0 atom%≥c≥6 atom%, 6.8 atom%≥x≥10.8 atom%, 2.2 atom%≥y≥9.8 atom%, 0 atom%≥z≥4.2 atom%, and 0 atom%≥t≥3.9 atom%, is molded by solidifying with a binding material; a coil covered by the green compact core; and a terminal part for external connection connected to the coil. The terminal part includes: a Cu base material 15; a ground layer 16 formed on a surface of the Cu base material; and a surface electrode layer 17 formed on a surface of the ground layer. The ground layer is formed of Ni. The front surface electrode layer is formed of Ag or Ag-Pd. <P>COPYRIGHT: (C)2012,JPO&INPIT |
