| 发明名称 |
PHOTOSENSITIVE HEAT-RESISTANT RESIN PRECURSOR COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive heat-resistant resin precursor composition containing a silane coupling agent which, when added to a heat-resistant resin precursor composition, enhances adhesion of the heat-resistant resin film to a substrate even in use at a low heat treatment temperature. <P>SOLUTION: The photosensitive heat-resistant resin precursor composition contains the silane coupling agent comprising one of specific two organosilicon compounds or a mixture of the compounds. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2011256394(A) |
申请公布日期 |
2011.12.22 |
| 申请号 |
JP20110173490 |
申请日期 |
2011.08.09 |
| 申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
SASAKI TAKAHIRO;KATAOKA YASUHIRO |
| 分类号 |
C08L79/04;C07F7/18;C08K5/5419;C08K5/5465;C08L61/08 |
主分类号 |
C08L79/04 |
| 代理机构 |
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