| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a management method of an exposure mask which uses exposure energy information of a wafer. <P>SOLUTION: Information of a mask used for exposing a wafer with an exposure apparatus are calculated from the exposure apparatus. A light energy value applied during the exposure of each wafer using the mask are calculated. The calculated light energy value is stored in a data server. The same data are collected from all wafer exposure processes performed at a plurality of exposure apparatuses within a semiconductor package and the exposure information about the exposure energy relating to a plurality of masks used by a plurality of exposure apparatuses are accumulated and managed. Accordingly, the exposure degree of the mask about the exposure energy, as a direct cause of contamination of masks such as crystal growth and haze, is directly calculated and then defects of masks are predicted together with measures according that, so that deterioration of a yield of the semiconductor is prevented and the yield of the semiconductor is increased. <P>COPYRIGHT: (C)2012,JPO&INPIT |
