REDUCED SOLIDS ADHESIVE COMPOSITION AND RELATED METHODS

摘要

The present invention relates generally to improved adhesive compositions that contain a reduced amount of solids, and using this improved adhesive composition in a process for making products such as corrugated paperboard. In one aspect, the process produces consistently high quality corrugated paperboard and eliminates or considerably reduces common defects such as warping, washboarding, and brittle paperboard, while using significantly less adhesive than the current corrugating process. In another aspect, the addition of less water to the corrugated paperboard allows less energy to be used to dry the corrugated paperboard.