发明名称 Tin electroplating solution and a method for tin electroplating
摘要 A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.
申请公布号 US2011308960(A1) 申请公布日期 2011.12.22
申请号 US20100657096 申请日期 2010.01.13
申请人 ORIHASHI MASANORI;ROHM AND HAAS ELECTRONIC MATERIALS LLC 发明人 ORIHASHI MASANORI
分类号 C25D3/32 主分类号 C25D3/32
代理机构 代理人
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