BACKFILLED POLYCRYSTALLINE DIAMOND CUTTER WITH HIGH THERMAL CONDUCTIVITY

摘要

A front face of a diamond table mounted to a substrate is processed, for example through an acid leach, to remove interstitial catalyst binder and form a thermal channel. A material is then introduced to the front face of the diamond table, the introduced material backfilling the front face of the diamond table to fill interstitial voids left by removal of the catalyst binder in the thermal channel to a desired depth. The material is selected to be less thermally expandable than the catalyst binder and/or more thermally conductive than the catalyst binder and/or having a lower heat capacity than the catalyst binder.