CONDUCTIVE RESIN COMPOSITION, PROCESS FOR PRODUCING ELECTRONIC PART USING SAME, CONNECTING METHOD, CONNECTION STRUCTURE, AND ELECTRONIC PART

摘要

To provide a conductive resin composition with which high conduction reliability can be ensured, a method for manufacturing, using the composition, an electronic component having high bonding reliability, a bonding method and a bonding structure by which objects to be bonded can be bonded to each other with certainty, and a highly reliable electronic component having the bonding structure. A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or hard spherical carbon formed by coating the surface of a spherical base carbon particle with pitch-derived fine carbon pieces, is used. The conductive resin composition is suppled to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.