| 摘要 |
<p>PURPOSE: An adhesive film for circuit connection, a use thereof, a circuit connection structure, a producing method thereof, and a connection method of a circuit member are provided to prevent the deformation of a glass substrate having the thinner thickness than a conventional circuit board. CONSTITUTION: An adhesive film(10) for circuit connection is formed with a conductive adhesive layer(3b) including an adhesive composition(4b) and conductive particles(5), and an insulating adhesive layer(3a) without the conductive particles. The adhesive composition in the conductive adhesive layer contains a film-forming material, an epoxy resin, a latent hardener, and an insulating particulate having the average particle diameter less than 1 micron.</p> |
