| 摘要 |
<p>PURPOSE: An adhesive film for the circuit connection, a use thereof, a circuit connection structure, a producing method of the circuit connection structure, and a connection method of a circuit member are provided to prevent the deformation of a glass substrate by excellent connection reliability of the adhesive film. CONSTITUTION: An adhesive film(10) for the circuit connection comprises the following: a conductive adhesive layer(3b) including an adhesive composition(4b) and conductive particles(5); and an insulating adhesive layer(3a) without the conductive particles, including another adhesive composition(4a). The adhesive composition contains a film forming material having the glass transition temperature of 40-70 deg C, an epoxy resin, and a latent hardener.</p> |
