发明名称 Pattern formation method
摘要 After forming a resist film made from a chemically amplified resist material pattern exposure is carried out by selectively irradiating the resist film with exposing light while supplying, onto the resist film, water that includes triphenylsulfonium nonaflate, that is, an acid generator, and is circulated and temporarily stored in a solution storage. After the pattern exposure, the resist film is subjected to post-exposure bake and is then developed with an alkaline developer. Thus, a resist pattern made of an unexposed portion of the resist film can be formed in a good shape.
申请公布号 US8080364(B2) 申请公布日期 2011.12.20
申请号 US20090412942 申请日期 2009.03.27
申请人 ENDO MASAYUKI;SASAGO MASARU;PANASONIC CORPORATION 发明人 ENDO MASAYUKI;SASAGO MASARU
分类号 G03F7/20;G03F7/38;G03F7/004;H01L21/027;H01L21/30;H01L21/302 主分类号 G03F7/20
代理机构 代理人
主权项
地址