| 摘要 |
PURPOSE: A semiconductor package is provided to prevent failure even long time usage by reducing heat which is generated from a semiconductor package. CONSTITUTION: In a semiconductor package, a substrate(1) comprises a base part(10) and a substrate optical signal part(50) which is formed on the base part. The substrate comprises a first side(12) and a second side(14). A thermoelectric part(70) is adhered on the second side by using a bonding layer(76). Heat which is generated through the operation of a semiconductor chip is discharges outside through a heat sink. A substrate optical signal part(50) comprises a substrate lighting-emitting area(51), a substrate light receiver(52), and a substrate light control unit(56). |
