发明名称 |
MANUFACTURING METHOD OF SOLID-STATE IMAGING ELEMENT, SOLID-STATE IMAGING ELEMENT, AND IMAGING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a solid-state imaging element capable of improving pixel characteristics of a solid-state imaging element and reducing a manufacturing cost. <P>SOLUTION: The manufacturing method of the solid-state imaging element comprises: a step of forming a first conductive charge storage region 5 where a sensor part is configured in a semiconductor substrate 1 by ion implantation using the same mask when the solid-state imaging element is manufactured and forming a second conductive second impurity region 6 on this conductive charge storage region 5; a step of forming a transfer gate 9 that constitutes a charge transfer part on a surface of the semiconductor substrate 1 extending over the charge storage region 5; and a step of forming a second conductive first impurity region 7 whose impurity concentration is higher than impurity concentration of the second conductive second impurity region 6 on the surface of the sensor part of the semiconductor substrate 1 by ion implantation using the transfer gate 9 as the mask. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011253962(A) |
申请公布日期 |
2011.12.15 |
申请号 |
JP20100127323 |
申请日期 |
2010.06.02 |
申请人 |
SONY CORP |
发明人 |
HA SANG HUN;ISHIWATARI HIROAKI |
分类号 |
H01L27/146;H04N5/369;H04N5/374 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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