| 摘要 |
According to the present invention, it can be switched whether or not to apply a magnetic field to a substrate depending on a material of a film to be formed, and a magnetic layer and a non-magnetic layer can be formed in the same chamber. A sputtering apparatus 100 includes a substrate holder 102 configured to support a substrate W; magnet holders 106 that are disposed around the substrate holder; magnets 104 that are movably loaded on the magnet holders; supporting members 103 that protrude from the substrate holder so as to face the magnets; connecting members 105 that protrude from the magnets to face the substrate holder; a rotation mechanism 121 configured to rotationally move at least one of the substrate holder and the magnet holders; and a connection switching mechanism 122 configured to move, when positions of the supporting members and the connecting members are matched to each other by rotational movement of the rotation mechanism, the substrate holder upward and downward to engage the supporting members and the connecting members with each other or separate the supporting members and the connecting members from each other, and switch whether or not to apply a magnetic field to the substrate W. |
