发明名称 |
LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD |
摘要 |
A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is laid between the first wiring board and the second wiring board and electrically connects the first land and the second land via a conducting material; and a plate that has a through-hole through which the first land is connected to the second land, wherein a diameter of the through-hole of the plate is larger than a diameter of a component that is made by filling the conducting material. |
申请公布号 |
US2011303453(A1) |
申请公布日期 |
2011.12.15 |
申请号 |
US201113074442 |
申请日期 |
2011.03.29 |
申请人 |
YOSHIMURA HIDEAKI;HONDO ASAMI;FUJITSU LIMITED |
发明人 |
YOSHIMURA HIDEAKI;HONDO ASAMI |
分类号 |
H05K1/11;H05K3/10 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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