发明名称 COMPOSITE MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a technology capable of preventing mutual electrical interference among multiple electronic components mounted on a circuit board easily without forming a cavity in the circuit board. <P>SOLUTION: An end face of a cylindrical member 3 on one opening side thereof is mounted on a surface 2a of a circuit board, and at least one electronic component 5 out of multiple electronic components 5 mounted on a circuit board 2 is mounted in a region 2b surrounded by the cylindrical member 3 on the surface 2a of the circuit board. Since electrical interference between the electronic component 5 mounted in the region 2b surrounded by the cylindrical member 3 and the electronic component 5 mounted in other region can be prevented, mutual electrical interference among multiple electronic components 5 mounted on the circuit board 2 can be prevented easily without forming a cavity in the circuit board 2. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011253976(A) 申请公布日期 2011.12.15
申请号 JP20100127526 申请日期 2010.06.03
申请人 MURATA MFG CO LTD 发明人 YOSHIDA MASATO
分类号 H01L25/04;H01L25/18 主分类号 H01L25/04
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