MULTI-CHIP PACKAGE WITH PILLAR CONNECTION

摘要

A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described.